CEI EN IEC 60286-3
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
standard by Comitato Elettrotecnico Italiano , 04/01/2023
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About This Item
Full Description
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Document History
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CEI EN IEC 60286-3
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Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes- Most Recent
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CEI EN IEC 60286-3
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes- Historical Version
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CEI EN 60286-3
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes- Historical Version
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