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Full Description

SAME AS IEC 61188-6-1

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

 

Document History

  1. DANSK DSF/PREN IEC 61188-6-1


    Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design – Generic requirements for land pattern on circuit boards

    • Historical Version
  2. DANSK DS/EN IEC 61188-6-1

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    Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design – Generic requirements for land pattern on circuit boards

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