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IEC 61189-2 Ed. 1.0 b:1997 [ Withdrawn ]

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

standard by International Electrotechnical Commission , 04/10/1997

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About This Item

 

Full Description

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.
 

Product Details

Edition:
1.0
Published:
04/10/1997
Number of Pages:
139
File Size:
1 file , 1.2 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. IEC 61189-2 Ed. 2.0 en:2006


    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

    • Most Recent

  2. IEC 61189-2 Ed. 1.0 b:1997

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    Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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Amendments, rulings, supplements, and errata

  1. IEC 61189-2 Amd.1 Ed. 1.0 en:2000


    Amendment 1