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IEC 62878-2-5 Ed. 1.0 b:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

standard by International Electrotechnical Commission , 09/16/2019

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Full Description

IEC 62878-2-5 defines the data format for active and passive devices embedded inside an organic board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This PAS describes the expression of 3D data information, the concept of layers, the structure of board data, and definitions of information repeatedly used in design.
 

Product Details

Edition:
1.0
Published:
09/16/2019
Number of Pages:
112
File Size:
1 file , 5.8 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. IEC 62878-2-5 Ed. 1.0 b:2019

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    Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

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  2. IEC 62878-2-5 Ed. 1.0 en:2019


    Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

    • Historical Version

  3. IEC/PAS 62878-2-5 Ed. 1.0 en:2015


    Device embedded substrate - Guidelines - Data format

    • Historical Version