-
-
Available Formats
- Options
- Availability
- Priced From ( in USD )
-
Available Formats
-
- Immediate download
- $100.00
- Add to Cart
Customers Who Bought This Also Bought
-
Advances in Powder Metallurgy & Particulate Materials-2015
Priced From $400.00 -
Advances in Powder Metallurgy & Particulate Materials-2013
Priced From $200.00 -
Fatigue Design Concepts for P/M Parts and Required Materi...
Priced From $45.00 -
Advances in Tungsten, Refractory & Hardmaterials IX
Priced From $550.00
About This Item
Full Description
- Sinter-Brazing PM Components Using Sinter Braze Paste Methods by Mark K. Barr, Thomas F. Podbesek, and Gary L. Cowan
- Effect of Sintering Aid and Pure Hydrogen on the Densification of Copper Powders by Ching-Fong Chen, David Dombrowski, Ricardo Lebensohn, Bjorn Clausen, Robert Forsyth, and Reeju Pokharel
- Cost Saving and Quality Improvement by Controlling Furnace C-Potential Leading to In-spec Part Carbon Content - Further Improvements and Some Good News for MIM Industry by Akin Malas, Soren Wiberg, and Eric Will
- Gas Monitoring System for Delubing Zone in PM Sintering Furnaces by Mark Kim, Rod Rowland and Tony Zahrah
- Dream Mesh Belt Sintering Furnace Design for Good Dimensional Control by Ravi P. Malhotra
- The Effect of Sintering Tray Thermal Responsiveness on PM Part Quality by Jon R. Leist and Stephen L. Feldbauer
- Platinum Performance: Increasing Belt Life Performance and Maximizing Production Time in Powder Metal High Temperature Sintering Operations by Cory J. Bloodsworth and Stephen L. Feldbauer
- Ceramic Temperature Sensor Technology vs. Thermocouples by Thomas McInnerney
- Characteristic Application of Ceramic Hollow Spheres and Their Qualification by Ryuma M. Matsuda, Hiroyuki Wada, Osamu Odawara, and Galina Xanthopoulou
- Modular Plants Provide Low Cost, Reliable Hydrogen for Powder Metallurgy by Goutam Shahani, Steven Parente, Kyle Finley, Nick Onelli, and Grzegorz Moroz
- The Gravitational Role in Liquid Phase Sintering by Randall M. German
- Liquid-Phase Diffusion Bonding: Temperature Effects and Solute Redistribution in High Temperature Lead-Free Composite Solders by S.M. Choquette and I.E. Anderson
- New Findings on the Wettability and Spreading of Copper on Iron Base Substrates by E. Bernardo, R. de Oro, M. Campos, and J. M. Torralba