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About This Item
Full Description
- Inclusion of lead-free alloy test conditions;
- Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years;
- Inclusion of new component types, and updating test parameters for the whole component list.
Document History
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IEC 60068-2-69 Ed. 3.1 b:2019
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION- Most Recent
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IEC 60068-2-69 Ed. 3.0 b:2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method- Historical Version
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IEC 60068-2-69 Ed. 2.0 b:2007
viewing
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method- Historical Version
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IEC 60068-2-69 Ed. 2.0 en:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method- Historical Version
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IEC 60068-2-54 Ed. 2.0 b:2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method- Historical Version
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IEC 60068-2-54 Ed. 2.0 en:2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method- Historical Version
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IEC 60068-2-69 Ed. 1.0 b:1995
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method- Historical Version
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IEC 60068-2-54 Ed. 1.0 b:1985
Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method- Historical Version