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IEC/PAS 62137-3 Ed. 1.0 en:2008

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

standard by International Electrotechnical Commission - Publicly Available Standard , 11/13/2008

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Full Description

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.
 

Product Details

Edition:
1.0
Published:
11/13/2008
Number of Pages:
41
File Size:
1 file , 1.5 MB
Note:
This product is unavailable in Canada
 

Document History

  1. IEC 62137-3 Ed. 1.0 b:2011


    Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

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  2. IEC/PAS 62137-3 Ed. 1.0 en:2008

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    Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

    • Historical Version