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About This Item
Full Description
NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors, the following text is applied.
NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20.
This standard cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant change is the inclusion of Pb (lead)-free backward compatibility.
Document History
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IEC 60749-21 Ed. 2.0 b:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability- Most Recent
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IEC 60749-21 Ed. 1.0 b:2005
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability- Historical Version
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IEC 60749-21 Ed. 1.0 b:2004
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability- Historical Version