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IEC 60749-20 Ed. 3.0 b:2020

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

standard by International Electrotechnical Commission , 08/01/2020

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About This Item

 

Full Description

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

 

Product Details

Edition:
3.0
Published:
08/01/2020
ISBN(s):
9782832287279
Number of Pages:
60
File Size:
1 file , 2.5 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. IEC 60749-20 Ed. 3.0 b:2020

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    Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

    • Most Recent

  2. IEC 60749-20 Ed. 2.0 b:2008


    Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

    • Historical Version

  3. IEC 60749-20 Ed. 1.0 b CORR1:2003


    Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

    • Historical Version