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About This Item
Full Description
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
Document History
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IEC 60749-3 Ed. 2.0 b:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination- Most Recent
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IEC 60749-3 Ed. 2.0 en:2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination- Historical Version
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IEC 60749-3 Ed. 1.0 b CORR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination- Historical Version
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IEC 60749-3 Ed. 1.0 b:2002
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection- Historical Version