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About This Item
Full Description
a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1;
b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage;
c) allowance of additional time-to-test delay or return-to-stress delay.
Document History
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IEC 60749-4 Ed. 2.0 b:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)- Most Recent
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IEC 60749-4 Ed. 2.0 en:2017
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)- Historical Version
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IEC 60749-4 Ed. 1.0 b CORR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)- Historical Version
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IEC 60749-4 Ed. 1.0 b:2002
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)- Historical Version