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About This Item
Full Description
This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.
This edition includes the following significant technical changes with respect to the previous edition:
a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;
b) additional variant – ‘adhesive tape pull test’.
Document History
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IEC 60749-9 Ed. 2.0 b:2017
viewing
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking- Most Recent
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IEC 60749-9 Ed. 2.0 en:2017
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking- Historical Version
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IEC 60749-9 Ed. 1.0 b CORR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking- Historical Version
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IEC 60749-9 Ed. 1.0 b:2002
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking- Historical Version