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About This Item
Full Description
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.
Document History
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IEC 61190-1-2 Ed. 3.0 b:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly- Most Recent
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IEC 61190-1-2 Ed. 2.0 b:2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly- Historical Version
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IEC 61190-1-2 Ed. 2.0 en:2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly- Historical Version
-
IEC 61190-1-2 Ed. 1.0 b:2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly- Historical Version