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IEC 61191-3 Ed. 1.0 b:1998 [ Withdrawn ]

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

standard by International Electrotechnical Commission , 08/28/1998

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Full Description

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
 

Product Details

Edition:
1.0
Published:
08/28/1998
Number of Pages:
31
File Size:
1 file , 530 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. IEC 61191-3 Ed. 2.0 b:2017


    Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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  2. IEC 61191-3 Ed. 2.0 en:2017


    Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

    • Historical Version

  3. IEC 61191-3 Ed. 1.0 b:1998

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    Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

    • Historical Version