-
-
Available Formats
- Options
- Availability
- Priced From ( in USD )
-
Available Formats
-
- Immediate download
- $333.60
- Add to Cart
-
- Printed Edition
- Ships in 1-2 business days
- $333.60
- Add to Cart
-
- Printed Edition + PDF
- Immediate download
- $512.40
- Add to Cart
Customers Who Bought This Also Bought
-
IEC 60721-2-2 Ed. 2.0 b:2012
Priced From $114.00 -
IEC 60721-2-3 Ed. 2.0 b:2013
Priced From $30.00 -
IEC 60068-2-69 Ed. 3.1 b:2019
Priced From $637.20 -
IEC 60068-2-78 Ed. 2.0 b:2012
Priced From $61.20
About This Item
Full Description
This part of IEC 60068, which is a Technical Report, describes the creation of temperature-time profiles (in specific envelope profiles) for reflow soldering of electronic assemblies, considering tolerances resulting from the accuracy of the measuring equipment, preparation method and specifications of the manufacturers of components, circuit boards, solder paste, etc.).
The envelope profile given in this document does not represent a temperature-time profile for qualification but defines the reflow process window for the soldering of electronic assemblies. Qualification profiles can be found, for example, in IEC 60068-2-58 for resistance to soldering heat, or in IEC 60749-20, IEC 61760-4 and IPC/JEDEC J-STD-020E for moisture sensitivity classification of components.
Document History
-
IEC/TR 60068-3-12 Ed. 3.0 en:2022
viewing
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile- Most Recent
-
IEC/TR 60068-3-12 Ed. 2.0 b:2014
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile- Historical Version
-
IEC/TR 60068-3-12 Ed. 1.0 en:2007
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile- Historical Version