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About This Item
Full Description
- it includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a "zero defect" approach;
- it introduces a product classification based on application requirements;
- it includes an extension of the list of styles and dimensions;
- it includes the use of an extended scope of stability class definitions;
- it includes the extension of the lists of preferred values of ratings;
- it includes test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- it includes a new set of severities for a shear test;
- it includes definitions for a test board;
- it includes the replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- it includes an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- it includes requirements applicable to 0-ohm resistors (jumpers);
- it includes recommendations for the denomination, description, packaging and quality assessment of radial formed styles;
- it includes prescriptions for endurance testing at room temperature, supplementary to the rulings of IEC 60115-1.
Document History
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IEC 60115-2 Ed. 4.0 en:2023
Fixed resistors for use in electronic equipment – Part 2: Sectional specification: Low-power film resistors with leads for throughhole assembly on circuit boards (THT)- Most Recent
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IEC 60115-2 Ed. 3.0 b:2014
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Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors- Historical Version
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IEC 60115-2 Ed. 2.0 b:1982
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Fixed low-power non-wirewound resistors- Historical Version