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About This Item
Full Description
IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.
Document History
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DANSK DSF/FPREN IEC 60749-5
Semiconductor devices – Mechanical and climatic test methods – Part 5: Steady-state temperature humidity bias life test- Historical Version
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DANSK DSF/PREN IEC 60749-5
Semiconductor devices – Mechanical and climatic test methods – Part 5: Steady-state temperature humidity bias life test- Historical Version
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DANSK DS/EN IEC 60749-5
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Semiconductor devices – Mechanical and climatic test methods – Part 5: Steady-state temperature humidity bias life test- Most Recent