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Defines the rapid change of temperature test method and the two-fluid-bath method. This test method may also be used, employing fewer cycles, to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification.
 

Amendments, rulings, supplements, and errata

  1. IEC 60749-11 Ed. 1.0 b COR. 2:2003

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    Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

  2. IEC 60749-11 Ed. 1.0 b COR. 1:2003

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    Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method