1152685

IEC 60749-34 Ed. 1.0 b:2005

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

standard by International Electrotechnical Commission , 11/21/2005

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Full Description

Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
 

Product Details

Edition:
1.0
Published:
11/21/2005
Number of Pages:
21
File Size:
1 file , 510 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. IEC 60749-34 Ed. 2.0 b:2010


    Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

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  2. IEC 60749-34 Ed. 1.0 b:2005

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    Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

    • Historical Version

  3. IEC 60749-34 Ed. 1.0 b:2004


    Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

    • Historical Version