31.200: Integrated circuits. Microelectronics
Search Results
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MOST RECENT
IEC 60748-22-1 Ed. 2.0 b:1997
Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
standard by International Electrotechnical Commission, 04/10/1997.
Languages: English, French
- MULTI-USER
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MOST RECENT
IEC 60748-2-2 Amd.1 Ed. 1.0 b:1994
Amendment 1 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
Amendment by International Electrotechnical Commission, 06/07/1994.
Languages: English, French
- MULTI-USER
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MOST RECENT
IEC 60748-2-2 Ed. 1.0 b:1992
Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
standard by International Electrotechnical Commission, 02/29/1992.
Languages: English, French
Amendments, rulings, and supplements: IEC 60748-2-2 Amd.1 Ed. 1.0 b:1994
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MOST RECENT
IEC 60748-22 Ed. 2.0 b:1997
Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
standard by International Electrotechnical Commission, 04/10/1997.
Languages: English, French
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MOST RECENT
IEC 60748-23-1 Ed. 1.0 en:2002
Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
standard by International Electrotechnical Commission, 05/15/2002.
Languages: English
- MULTI-USER
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MOST RECENT
IEC 60748-23-2 Ed. 1.0 en:2002
Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests
standard by International Electrotechnical Commission, 05/23/2002.
Languages: English
- MULTI-USER
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MOST RECENT
IEC 60748-23-3 Ed. 1.0 en:2002
Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report
standard by International Electrotechnical Commission, 05/17/2002.
Languages: English
- MULTI-USER
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MOST RECENT
IEC 60748-23-4 Ed. 1.0 en:2002
Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification
standard by International Electrotechnical Commission, 05/17/2002.
Languages: English
- MULTI-USER
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MOST RECENT
IEC 60748-23-5 Ed. 1.0 en:2003
Semiconductor devices - Integrated circuits, Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval
standard by International Electrotechnical Commission, 10/03/2003.
Languages: English
- MULTI-USER
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MOST RECENT
IEC 60748-2-3 Ed. 1.0 b:1992
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)
standard by International Electrotechnical Commission, 02/20/1992.
Languages: English, French
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