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IEC 60691 Ed. 3.0 b:2002 [ Withdrawn ]

Thermal-links - Requirements and application guide

standard by International Electrotechnical Commission , 12/19/2002

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Full Description

Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circum- stances in the immediate surroundings of such thermal-links are comparable with those in this standard.
 

Product Details

Edition:
3.0
Published:
12/19/2002
Number of Pages:
77
File Size:
1 file , 3.7 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. IEC 60691 Ed. 4.1 en:2019


    Thermal-links - Requirements and application guide CONSOLIDATED EDITION

    • Most Recent

  2. IEC 60691 Ed. 4.0 b:2015


    Thermal-links - Requirements and application guide

    • Historical Version

  3. IEC 60691 Ed. 3.2 b:2010


    Thermal-links - Requirements and application guide CONSOLIDATED EDITION

    • Historical Version

  4. IEC 60691 Ed. 3.0 b:2002

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    viewing


    Thermal-links - Requirements and application guide

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IEC 60691 Amd.2 Ed. 3.0 b:2010


    Amendment 2 - Thermal-links - Requirements and application guide

  2. IEC 60691 Amd.1 Ed. 3.0 b:2006


    Amendment 1 - Thermal-links - Requirements and application guide