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About This Item

 

Full Description

This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).

All packaged semiconductor devices, thin film circuits, acoustic wave devices, optoelectronic devices, hybrid integrated circuits (HICs), discrete, and multi-chip modules (MCMs) containing any of these devices as well as unpackaged singulated bare die, and die which are still part of a wafer are to be evaluated according to this standard.

 

Document History

  1. ESD JS-001-2023

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    ESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing - Human Body Modal (HBM) - Device Level

    • Most Recent
  2. ESD JS-001-2017


    ESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing - Human Body Modal (HBM) - Component Level

    • Historical Version
  3. ESD JS-001-2014


    ESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing - Human Body Modal (HBM) - Component Level

    • Historical Version
  4. ESD JS-001-2012


    ESDA/JEDEC Joint Standard for Electrostatic Testing, Human Body Modal (HBM) - Component Level

    • Historical Version
  5. ESD JS-001-2011


    ESDA/JEDEC Joint Standard for Electrostatic Testing, Human Body Modal (HBM) - Component Level

    • Historical Version
  6. ESD JS-001-2010


    ESDA/JEDEC Joint Standard for Electrostatic Testing, Human Body Modal (HBM) - Component Level (Revision and Replacement of ESD STM5.1-2007)

    • Historical Version