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Full Description

BS EN 62435-5:2017, is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.


Cross References:
IEC 62435-2
EN 62435-2
IEC 60068-2-17
EN 60068-2-17
IEC 60068-2-20
EN 60068-2-20
IEC 60749-3
EN 60749-3
IEC 60749-20-1
EN 60749-20-1
IEC 60749-21
EN 60749-21
IEC 60749-22
EN 60749-22
IEC 61340-5-1
EN 61340-5-1
IEC 61340-2-1
EN 61340-2-1
IEC/TR 62258-3
CLC/TR 62258-3
IEC 62435-1
EN 62435-1
IEC/TR 61945
IEC/TR 62380
IEC 62435-4
JEDEC J-STD-002
JEDEC J-STD-033
JEDEC JESD22-B116
JEDEC JESD22-B118
ASTM D3330


All current amendments available at time of purchase are included with the purchase of this document.