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BS EN IEC 61189-5-601:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

standard by British-Adopted European Standard , 03/19/2021

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Full Description

This part of IEC 61189 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.

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Product Details

Published:
03/19/2021
ISBN(s):
9780580965845
Number of Pages:
46
File Size:
1 file , 2 MB
Product Code(s):
30352487, 30352487, 30352487
Note:
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