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About This Item

 

Full Description

Provides a guide to an interconnection system for circuit board partitioning, allowing for a modular construction and solderless assembly of the sub-units.

Cross References:
BS 2011:Part 1.1
BS 2011:Part 2.1Ea
BS 2011:Part 2.1Eb
BS 2011:Part 2.1Fc
BS 2011:Part 2.1M
BS 5954:Part 2
BS 5954:Part 3
BS CECC 00015:Part 1
IEC 603-2