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About This Item
Full Description
Cross References:
IEC 60068-1:2013
IEC 61190-1-3:2007
ISO 683-17:1999
IEC 60068-2-66:1994
ISO 683-1:2016
IEC 61190-1-3:2007/AMD1:2010
ISO 683-4:2014
IEC 60068-2-20:2008
ISO 683-3:2016
ISO 683-2:2016
IEC 60068-2-2:2007
ISO 683-4:2016
IPC J-STD-003C
ISO 6362-4:2012
ISO 6362-6:2012
ISO 9453:2014
IEC 60068-3-13:2016
ISO 9454-1:1990
ISO 6362-2:2014
ISO 6362-1:2012
IEC 61190-1-1:2002
ISO 6362-3:2012
ISO 6362-7:2012
ISO 6362-5:2012
Incorporates the following:
Amendment, September 2019; Corrigendum, May 2018
Document History
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BS EN 60068-2-69:2017+A1:2019
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Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method- Most Recent
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BS EN 60068-2-69:2017
Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method- Historical Version
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BS EN 60068-2-69:2007
Environmental testing-Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method- Historical Version
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BS EN 60068-2-54:2006
Environmental testing-Tests-Test Ta: Solderability testing of electronic components by the wetting balance method- Historical Version
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BS EN 60068-2-69:1996
Environmental testing. Test methods-Tests. Test Te. Solderability testing of electronic components for surface mount technology by the wetting balance method- Historical Version
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BS 2011-2.1TA:1989
Environmental testing. Tests-Test Ta. Soldering. Solderability testing by the wetting balance method- Historical Version