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About This Item
Full Description
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
This edition includes the following significant technical changes with respect to the previous edition:
- integration of IEC 60068-2-54;
- inclusion of tests of printed boards;
- inclusion of new component types, and updating test parameters for the whole component list;
- inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.
Document History
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IEC 60068-2-69 Ed. 3.1 b:2019
viewing
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION- Most Recent
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IEC 60068-2-69 Ed. 3.0 b:2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method- Historical Version
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IEC 60068-2-69 Ed. 2.0 b:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method- Historical Version
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IEC 60068-2-69 Ed. 2.0 en:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method- Historical Version
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IEC 60068-2-54 Ed. 2.0 b:2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method- Historical Version
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IEC 60068-2-54 Ed. 2.0 en:2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method- Historical Version
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IEC 60068-2-69 Ed. 1.0 b:1995
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method- Historical Version
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IEC 60068-2-54 Ed. 1.0 b:1985
Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method- Historical Version