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About This Item

 

Full Description



Cross References:
IEC 60194
IEC 61189-5
IEC 61189-6
IEC 61190-1-1:2002
IEC 61190-1-2
ISO 9001
ISO 9453:2006
ISO 9454-1:1990
ISO 9454-2:1998
EN 60194:2006
EN 61189-5:2006
EN 61189-6:2006
EN 61190-1-1:2002
EN 61190-1-2:2007
EN ISO 9001:2000
EN ISO 9453:2006
EN 29454-1:1993
EN ISO 9454-2:2000


Incorporates the following:
Amendment, March 2011. Amends and replaces BS EN 61190-1-3:2007 which remains current
 

Document History

  1. BS EN IEC 61190-1-3:2018


    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

    • Most Recent
  2. BS EN 61190-1-3:2007+A1:2010

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    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    • Historical Version
  3. BS EN 61190-1-3:2007


    Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    • Historical Version
  4. BS 05/30133287 DC


    IEC 61190-1-3 ED 2. Attachment materials for electronic assembly. Part 1-3. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

    • Historical Version
  5. BS EN 61190-1-3:2002


    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    • Historical Version