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About This Item
Full Description
Cross References:
IEC/PAS 62647-2
IEC/TS 62647-2
IEC/PAS 62647-22
IEC/PAS 62647-23
IEC 60068-2-1
IEC 61188-5-1
IEC 61190
IEC 61191-1
IEC 61192
IEC/PAS 62647-3
IEC/PAS 62647-21
IPC J-STD-001
IPC/EIA J-STD-002
IPC/EIA J-STD-0003
IPC/EIA J-STD-005
IPC/EIA J-STD-006
IPC/JEDEC J-STD-020
IPC/EIA J-STD-028
IPC/JEDEC J-STD-033
IPC/JEDEC J-STD-609:2010
GEIA-STD-0005-1
GEIA-STD-0005-2:2006
GEIA-STD-0005-3
GEIA-HB-0005-1
GEIA-HB-0005-2
GEIA-HB-0005-3
IPC-SPV-WP-006
IPC-9701
IPC-A-610
IPC-6012
IPC-6013
IPC-6015
IPC-2221
IPC-2222
IPC-2223
IPC-2225
ANSI/GEIA-649-A:2004
ASME Y14.100:2004
All current amendments available at time of purchase are included with the purchase of this document.
Document History
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BS PD IEC/TS 62647-1:2012
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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Preparation for a lead-free control plan- Most Recent
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BS PD IEC/PAS 62647-1:2011
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Lead-free management- Historical Version