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About This Item
Document History
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DIN EN IEC 60749-20
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020- Most Recent
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DIN EN IEC 60749-20 - DRAFT
Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019- Historical Version
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DIN EN IEC 60749-20 - DRAFT
Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019- Historical Version
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DIN EN 60749-20
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009- Historical Version
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DIN EN 60749-20 - DRAFT
Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007- Historical Version
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DIN EN 60749-20
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003- Historical Version