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About This Item
Full Description
Cross References: IEC 60068-1:1988*IEC 60068-2-20:1979*IEC 60068-2-44:1995*IEC 60068-2-54:1985*IEC 60068-2-69:1995*IEC 60249-2-4:1987*IEC 60749:1996*
Replaces BS 2011-2.1Td:1990 which remains current.
Replaced by BS EN 60068-2-58:2004 but remains current.
Document History
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BS EN 60068-2-58:2015+A1:2018
Environmental testing-Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Most Recent
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BS EN 60068-2-58:2015
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Historical Version
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BS EN 60068-2-58:2004
Environmental testing-Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Historical Version
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BS EN 60068-2-58:1999
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Environmental testing. Test methods-Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Historical Version
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BS 2011-2.1TD:1990
Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Historical Version