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About This Item
Full Description
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
Cross References:
IEC 61190-1-3:2007 Cons Ed 2-1
ISO 683-4:2014 ED1
ISO 683-3:2016
ISO 683-4:2016
IEC 61190-1-3:2007/AMD1:2010
ISO 683-1:2016
IEC 60068-2-2 Ed.5.0
IEC 60068-1:2013
ISO 683-2:2016
IEC 60068-2-66:1994
IEC 60068-2-20:2008
ISO 683-17:1999 IPC J-STD-003C
ISO 6362-7:2012 ED1
ISO 9453:2014 ED3
ISO 6362-3:2012
ISO 6362-2:2014 ED4
ISO 6362-5:2012
ISO 6362-1:2012
IEC 61190-1-1:2002 Ed 1
ISO 9454-1:1990
ISO 6362-4:2012
IEC 60068-3-13:2016
ISO 6362-6:2012 ED1
All current amendments available at time of purchase are included with the purchase of this document.
Document History
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BS EN 60068-2-69:2017+A1:2019
Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method- Most Recent
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BS EN 60068-2-69:2017
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Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method- Historical Version
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BS EN 60068-2-69:2007
Environmental testing-Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method- Historical Version
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BS EN 60068-2-54:2006
Environmental testing-Tests-Test Ta: Solderability testing of electronic components by the wetting balance method- Historical Version
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BS EN 60068-2-69:1996
Environmental testing. Test methods-Tests. Test Te. Solderability testing of electronic components for surface mount technology by the wetting balance method- Historical Version
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BS 2011-2.1TA:1989
Environmental testing. Tests-Test Ta. Soldering. Solderability testing by the wetting balance method- Historical Version