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About This Item
Full Description
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations and is also applicable to surface mount devices (SMDs).
All current amendments available at time of purchase are included with the purchase of this document.
Document History
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BS EN IEC 60068-2-21:2021
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Environmental testing-Tests. Test U: Robustness of terminations and integral mounting devices- Most Recent
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BS EN 60068-2-21:2006
Environmental testing-Tests. Test U: Robustness of terminations and integral mounting devices- Historical Version
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BS EN 60068-2-20:2008
Environmental testing-Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads- Historical Version
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BS EN 60068-2-14:2000
Environmental testing. Test methods-Test N. Change of temperature- Historical Version
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BS EN 60068-2-33:2000
Environmental testing. Test methods-Guidance on change of temperature tests- Historical Version
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BS EN 60068-2-21:1999
Environmental testing. Test methods-Test U. Robustness of terminations and integral mounting devices- Historical Version
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BS EN 60068-2-21:1997
Environmental testing. Test methods-Test U. Robustness of terminations and integral mounting devices- Historical Version
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BS EN 60068-2-1:1993
Environmental testing. Test methods-Tests A. Cold- Historical Version
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BS 2011-2.1N:1985
Environmental testing. Tests-Test N. Change of temperature- Historical Version
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BS 2011-2.1A:1977
Environmental testing. Tests-Tests A. Cold- Historical Version
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BS 2011-2.1U:1984
Environmental testing. Tests-Test U. Robustness of terminations and integral mounting devices- Historical Version
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BS 2011-2.1T:1981
Environmental testing. Tests-Test T. Soldering- Historical Version
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BS 2011-2.2N:1977
Environmental testing. Guidance-Test N. Guidance on change of temperature tests- Historical Version