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About This Item
Full Description
Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.
Cross References:
IEC 61189-5-3:2015
IEC 61189-5-2:2015
IEC 61190-1-1:2002
EN 61190-1-1 (IEC 61190-1-1:2002 AS)
IEC 60194:2015
EN 61189-5-4 (IEC 61189-5-4:2015) AS
IEC 61189-5-4:2015
EN 61189-5-2 (IEC 61189-5-2:2015) AS
IEC 61190-1-2
EN 61190-1-2
EN 61189-5-3 (IEC 61189-5-3:2015) AS
IEC 61189-5
EN ISO 9453
ISO 9454-2
IEC 61189-6
EN 61189-5
EN 61189-6
ISO 9453
EN ISO 9454-1
ISO 9454-1
EN ISO 9454-2
ISO 1073-1
All current amendments available at time of purchase are included with the purchase of this document.
Document History
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BS EN IEC 61190-1-3:2018
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Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications- Most Recent
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BS EN 61190-1-3:2007+A1:2010
Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications- Historical Version
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BS EN 61190-1-3:2007
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications- Historical Version
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BS 05/30133287 DC
IEC 61190-1-3 ED 2. Attachment materials for electronic assembly. Part 1-3. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications- Historical Version
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BS EN 61190-1-3:2002
Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications- Historical Version