1850174

IEC 60191-6-4 Ed. 1.0 b:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

standard by International Electrotechnical Commission , 06/11/2003

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Full Description

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Product Details

Edition:: 1.0
Published:: 06/11/2003
Number of Pages:: 32
File Size:: 1 file , 480 KB
Note:: This product is unavailable in Ukraine, Russia, Belarus

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