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About This Item

 

Full Description

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
 

Document History

  1. IEC 60191-6-4 Ed. 1.0 b:2003


    Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

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  2. IEC 60191-6-4 Ed. 1.0 en:2003

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    Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

    • Historical Version