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- Immediate download
- $199.00
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- Printed Edition
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About This Item
Full Description
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.
Document History
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IEC 61191-2 Ed. 3.0 b:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies- Most Recent
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IEC 61191-2 Ed. 3.0 en:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies- Historical Version
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IEC 61191-2 Ed. 2.0 b:2013
viewing
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies- Historical Version
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IEC 61191-2 Ed. 1.0 b:1998
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies- Historical Version