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About This Item
Full Description
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
Document History
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IEC 61760-1 Ed. 3.0 b:2020
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Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)- Most Recent
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IEC 61760-1 Ed. 2.0 b:2006
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)- Historical Version
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IEC 61760-1 Ed. 2.0 en:2006
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)- Historical Version
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IEC 61760-1 Ed. 1.0 b:1998
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)- Historical Version