1041915

ISO 9455-17:2002

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

standard by International Organization for Standardization , 12/15/2002

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ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

 

Product Details

Published:
12/15/2002
Number of Pages:
21
File Size:
1 file , 880 KB
Same As:
ISO 9455-17:2002
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. ISO 9455-17:2024


    Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

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    Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

    • Historical Version