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About This Item
Full Description
Cross References:
EN 61191-2:2017
IEC 61191-2:2017
IEC 61760-1
EN 60194
IEC 61190-1-1
EN 61249-2-22
IEC 61190-1-3:2007
ISO 9454-2:1998
EN 61760-1
IEC 60068-2-20:2008
EN 61249-2-35
IEC 61249-2-35
EN ISO 9454-2:2000
EN 61190-1-1
EN 60068-1
IEC 60194
IEC 61249-2-22
EN 60068-2-20:2008
IEC 61190-1-2:2014
EN 61190-1-2:2014
IEC 60068-1
IEC 60068-2-54
IEC 61760-3
IEC 61760-4
IEC 60749-20
EN 60068-2-54
J-STD 020D
IEC 60068-2-69
J-STD 075
EN 60749-20
EN 61760-4
IEC 60068-3-13
IEC TR 60068-3-12
EN 60068-2-69
EN 61760-3
Incorporates the following:
Amendment, May 2018
Document History
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BS EN 60068-2-58:2015+A1:2018
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Environmental testing-Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Most Recent
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BS EN 60068-2-58:2015
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Historical Version
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BS EN 60068-2-58:2004
Environmental testing-Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Historical Version
-
BS EN 60068-2-58:1999
Environmental testing. Test methods-Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Historical Version
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BS 2011-2.1TD:1990
Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- Historical Version