1206104

ASTM D5109-99(2004)

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

standard by ASTM International , 10/10/1999

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Full Description

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

1.2 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.3 The procedures appear in the following sections:

 

Product Details

Published:
10/10/1999
Number of Pages:
8
File Size:
1 file , 110 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. ASTM D5109-12


    Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

    • Most Recent

  2. ASTM D5109-99(2004)

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    Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

    • Historical Version

  3. ASTM D5109-99


    Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

    • Historical Version