31.180: Printed Circuits And Boards
Search Results
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HISTORICAL
ASTM B885-09
This document has been replaced. View the most recent version.
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
standard by ASTM International, 04/15/2009.
Languages: English
Historical Editions: ASTM B885-09(2020), ASTM B885-09(2015), ASTM B885-97(2003), ASTM B885-97
- Redlines
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HISTORICAL
ASTM B885-09(2015)
This document has been replaced. View the most recent version.
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
standard by ASTM International, 05/01/2015.
Languages: English
Historical Editions: ASTM B885-09(2020), ASTM B885-09, ASTM B885-97(2003), ASTM B885-97
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MOST RECENT
ASTM B885-09(2020)
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
standard by ASTM International, 10/01/2020.
Languages: English
Historical Editions: ASTM B885-09(2015), ASTM B885-09, ASTM B885-97(2003), ASTM B885-97
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HISTORICAL
ASTM B885-97(2003)
This document has been replaced. View the most recent version.
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
standard by ASTM International, 06/10/2003.
Languages: English
Historical Editions: ASTM B885-09(2020), ASTM B885-09(2015), ASTM B885-09, ASTM B885-97
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HISTORICAL
ASTM D1867-01
This document has been replaced. View the most recent version.
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
standard by ASTM International, 09/10/2001.
Languages: English
Historical Editions: ASTM D1867-13, ASTM D1867-07, ASTM D1867-96
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HISTORICAL
ASTM D1867-07
This document has been replaced. View the most recent version.
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
standard by ASTM International, 05/01/2007.
Languages: English
Historical Editions: ASTM D1867-13, ASTM D1867-01, ASTM D1867-96
- Redlines
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MOST RECENT
ASTM D1867-13 [ Withdrawn ]
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)
standard by ASTM International, 11/01/2013.
Languages: English
Historical Editions: ASTM D1867-07, ASTM D1867-01, ASTM D1867-96
- Redlines
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HISTORICAL
ASTM D1867-96
This document has been replaced. View the most recent version.
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
standard by ASTM International, 01/01/1996.
Languages: English
Historical Editions: ASTM D1867-13, ASTM D1867-07, ASTM D1867-01
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HISTORICAL
ASTM D3380-10
This document has been replaced. View the most recent version.
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
standard by ASTM International, 01/01/2010.
Languages: English
Historical Editions: ASTM D3380-22, ASTM D3380-14, ASTM D3380-90(2003), ASTM D3380-90(1995)e1
- Redlines
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HISTORICAL
ASTM D3380-14
This document has been replaced. View the most recent version.
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
standard by ASTM International, 11/01/2014.
Languages: English
Historical Editions: ASTM D3380-22, ASTM D3380-10, ASTM D3380-90(2003), ASTM D3380-90(1995)e1
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