31.080.01: Semiconductor devices in general
Search Results
-
BS 02/209644 DC
IEC 60749-28. Ed.1. Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM)
standard by BSI Group, 10/11/2002.
Languages:
-
BS 04/30113827 DC
Draft British Standard. IEC62374 ED.1. Time dependent dielectric breakdown test
standard by BSI Group, 05/19/2004.
Languages:
-
BS 04/30119207 DC
IEC 60747-20-1. Semiconductor devices. Part 20-1. Handling, packing, labelling, shipping and use of moisture reflow sensitive surface mount devices
standard by BSI Group, 08/27/2004.
Languages:
-
BS 04/30124142 DC
IEC 60191-2/F60/ED 1. Proposed new additions of 11 variations. Thin, fine-pitch BGA (to be published as 171E outline)
standard by BSI Group, 10/20/2004.
Languages:
-
BS 04/30126443 DC
IEC 60749-38 ED.1. Semiconductor devices mechanical and climatic test methods. Part 38. Soft error rate testing of electronic components
standard by BSI Group, 12/08/2004.
Languages:
-
BS 05/30129010 DC
IEC 60191-1 ED.2. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
standard by BSI Group, 02/09/2005.
Languages:
-
BS 05/30129308 DC
IEC 60191-2/F54/ED.1. Mechanical standardization of semiconductor devices. Part 2. Large power package with 39 pins
standard by BSI Group, 02/14/2005.
Languages:
-
BS 05/30135225 DC
IEC 60749-9 ED 2. Semiconductor devices. Discrete devices. Part 9. Insulated-gate bipolar transistors (IGBTs)
standard by BSI Group, 06/20/2005.
Languages:
-
BS 05/30135649 DC
IEC 60269-4 ED 4. Low-voltage fuses. Part 4. Supplementary requirements for fuse-links for the protection of semiconductor devices
standard by BSI Group, 06/29/2005.
Languages:
-
BS 05/30135664 DC
IEC 60749-37. Semiconductor devices. Mechanical and climatic test methods. Part 37. Board level drop test method of components for handheld electronic products
standard by BSI Group, 06/30/2005.
Languages:
