31.080.01: Semiconductor devices in general
Search Results
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BS 05/30136813 DC
IEC 60191-2/F63 ED 1. Proposed new package outline, power package with 34 pins
standard by BSI Group, 07/21/2005.
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BS 05/30136816 DC
IEC 60191-2/F62 ED 1. Proposed new package outline, power package with 17 pins
standard by BSI Group, 07/21/2005.
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BS 06/30146860 DC
IEC 60191-2. Proposed new package outline. Small outline package (SOT) 3 -, 5- and 6-Lead SMD (to be published as 182E outline)
standard by BSI Group, 02/23/2006.
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BS 07/30148822 DC
BS IEC 62047-4. Semiconductor devices. Micro-electromechanical devices. Part 4. Generic specifications for MEMS
standard by BSI Group, 05/10/2007.
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BS 07/30155531 DC
BS EN 60191-6-17. Mechanical standardization of semiconductor devices. Part 6-17. Design guide for stacked packages and individual stackable packages. Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)
standard by BSI Group, 06/19/2007.
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BS 07/30163748 DC
BS EN 62416. Hot carrier test on MOS transistors
standard by BSI Group, 03/14/2007.
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BS 07/30163752 DC
BS EN 62417. Mobile ion tests. Bias temperature stress (BTS). Triangular voltage sweep (TVS)
standard by BSI Group, 03/14/2007.
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BS 07/30164953 DC
IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
standard by BSI Group, 04/19/2007.
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BS 07/30167960 DC
BS EN 60191-6. Mechanical standardization of semiconductor devices. Part 6. General rules for the preparation of outline drawings of surface mounted semicondutor device packages
standard by BSI Group, 06/25/2007.
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BS 07/30168484 DC
BS EN 60749-20. Semiconductor devices. Mechanical and climatic test methods. Part 20. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
standard by BSI Group, 07/05/2007.
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