31.080.01: Semiconductor devices in general

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  1. BS 08/30172394 DC▹

    BS EN 62047-7. Semiconductor devices. Micro-electromechanical devices. P art 7. MEMS FBAR Filter & Duplexer

    standard by BSI Group, 04/29/2008.

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  2. BS 08/30172909 DC▹

    BS EN 60191-6-19. Mechanical standardization of semiconductor devices. Part 6-19. Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

    standard by BSI Group, 01/03/2008.

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  3. BS 08/30175763 DC▹

    BS EN 60191-6-18. Mechanical standardization of semiconductor devices. Part 6-18. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

    standard by BSI Group, 01/03/2008.

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  4. HISTORICAL

    BS 08/30177286 DC▹

    This document has been replaced. View the most recent version.

    BS EN 62258-2. Semiconductor die products. Part 2. Exchange data formats

    standard by BSI Group, 01/30/2008.

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    Historical Editions: BS EN 62258-2:2011, BS EN 62258-2:2005, BS PD ES 59008-6-1:1999

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  5. BS 08/30177346 DC▹

    BS EN 62417. Mobile ion tests. Bias temperature stress (BTS). Triangular voltage sweep (TVS)

    standard by BSI Group, 01/31/2008.

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  6. BS 08/30181401 DC▹

    BS IEC 60747-14-1. Semiconductor devices. Part 14-1. Semiconductor sensors. Generic specification for sensors

    standard by BSI Group, 04/22/2008.

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  7. BS 08/30190026 DC▹

    BS EN 60191-6-20. Mechanical standardization of semiconductor devices. Part 6-20. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)

    standard by BSI Group, 12/01/2008.

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  8. BS 08/30190030 DC▹

    BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

    standard by BSI Group, 12/01/2008.

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  9. HISTORICAL

    BS 09/30190356 DC▹

    This document has been replaced. View the most recent version.

    BS EN 60749-40. Semiconductor devices. Mechanical and climatic test methods. Part 40. Board level drop test method using a strain gauge

    standard by BSI Group, 03/24/2009.

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    Historical Editions: BS EN 60749-40:2011

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  10. BS 09/30199792 DC▹

    BS EN 61747-6-1. Liquid crystal display devices. Part 6-1. Measuring methods for liquid crystal display modules. Transmissive type

    standard by BSI Group, 02/10/2009.

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