31.190: Electronic component assemblies

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  1. HISTORICAL

    17847

    IEC 60068-2-21 Ed. 5.0 b:1999▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

    standard by International Electrotechnical Commission, 01/07/1999.

    Languages: English, French

    Historical Editions: IEC 60068-2-21 Ed. 7.0 b:2021, IEC 60068-2-21 Ed. 6.0 b:2006, IEC 60068-2-21 Ed. 6.0 en:2006

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  2. HISTORICAL

    1821369

    IEC 60068-2-21 Ed. 6.0 b:2006▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

    standard by International Electrotechnical Commission, 06/22/2006.

    Languages: English, French

    Corrigenda: IEC 60068-2-21 Ed. 6.0 b CORR1:2012

    Historical Editions: IEC 60068-2-21 Ed. 7.0 b:2021, IEC 60068-2-21 Ed. 6.0 en:2006, IEC 60068-2-21 Ed. 5.0 b:1999

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  3. HISTORICAL

    1273949

    IEC 60068-2-21 Ed. 6.0 en:2006▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

    standard by International Electrotechnical Commission, 06/22/2006.

    Languages: English

    Historical Editions: IEC 60068-2-21 Ed. 7.0 b:2021, IEC 60068-2-21 Ed. 6.0 b:2006, IEC 60068-2-21 Ed. 5.0 b:1999

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  4. MOST RECENT

    2247757

    IEC 60068-2-21 Ed. 7.0 b:2021▹

    Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

    standard by International Electrotechnical Commission, 07/01/2021.

    Languages: English, French

    Historical Editions: IEC 60068-2-21 Ed. 6.0 b:2006, IEC 60068-2-21 Ed. 6.0 en:2006, IEC 60068-2-21 Ed. 5.0 b:1999

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  5. MOST RECENT

    1989744

    IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017▹

    Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    Amendment by International Electrotechnical Commission, 07/28/2017.

    Languages: English

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  6. HISTORICAL

    1587907

    IEC 60068-2-58 Ed. 3.0 b:2004▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    standard by International Electrotechnical Commission, 07/15/2004.

    Languages: English, French

    Historical Editions: IEC 60068-2-58 Ed. 4.1 en:2017, IEC 60068-2-58 Ed. 4.0 b:2015, IEC 60068-2-58 Ed. 3.0 b:2005

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  7. HISTORICAL

    1171432

    IEC 60068-2-58 Ed. 3.0 b:2005▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    standard by International Electrotechnical Commission, 02/23/2005.

    Languages: English, French

    Historical Editions: IEC 60068-2-58 Ed. 4.1 en:2017, IEC 60068-2-58 Ed. 4.0 b:2015, IEC 60068-2-58 Ed. 3.0 b:2004

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  8. HISTORICAL

    1893658

    IEC 60068-2-58 Ed. 4.0 b:2015▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    standard by International Electrotechnical Commission, 03/27/2015.

    Languages: English, French

    Amendments, rulings, and supplements: IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017

    Historical Editions: IEC 60068-2-58 Ed. 4.1 en:2017, IEC 60068-2-58 Ed. 3.0 b:2005, IEC 60068-2-58 Ed. 3.0 b:2004

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  9. MOST RECENT

    1989745

    IEC 60068-2-58 Ed. 4.1 en:2017▹

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) CONSOLIDATED EDITION

    standard by International Electrotechnical Commission, 07/28/2017.

    Languages: English

    Historical Editions: IEC 60068-2-58 Ed. 4.0 b:2015, IEC 60068-2-58 Ed. 3.0 b:2005, IEC 60068-2-58 Ed. 3.0 b:2004

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  10. MOST RECENT

    2080779

    IEC 60068-2-69 Amd.1 Ed. 3.0 b:2019▹

    Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    Amendment by International Electrotechnical Commission, 06/19/2019.

    Languages: English, French

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