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About This Item
Document History
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DIN EN 60068-2-69
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Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017 + COR1:2018 + A1:2019); German version EN 60068-2-69:2017 + AC:2018 + A1:2019- Most Recent
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DIN EN 60068-2-69/A1 - DRAFT
Draft Document - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 91/1499/CD:2018); Text in German und English- Historical Version
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DIN EN 60068-2-69 Corrigendum 1
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017/COR1:2018); German version EN 60068-2-69:2017/AC:2018-03- Historical Version
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DIN EN 60068-2-69
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017); German version EN 60068-2-69:2017- Historical Version
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DIN EN 60068-2-69 - DRAFT
Draft Document - Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method (IEC 91/1190/CD:2014)- Historical Version
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DIN EN 60068-2-69
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:2007); German version EN 60068-2-69:2007- Historical Version
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DIN EN 60068-2-54
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006); German version EN 60068-2-54:2006- Historical Version