31.080.99:Other semiconductor devices
Search Results
-
BS 05/30137514 DC
IEC 60747-14-4. Discrete semiconductor devices. Part 14-4. Semiconductor accelerometers
standard by BSI Group, 08/08/2005.
Languages:
-
BS 06/30146849 DC
ISO/IEC TR 62258-7. Semiconductor die products. Part 7. XML schema for data exchange
standard by BSI Group, 02/23/2006.
Languages:
-
BS 07/30162213 DC
BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
standard by BSI Group, 02/07/2007.
Languages:
-
HISTORICAL
BS 07/30163302 DC
This document has been replaced. View the most recent version.
BS EN 62047-6. Semiconductor devices. Micro-electromechanical devices. Part 6. Axial fatigue testing methods of thin film materials
standard by BSI Group, 03/06/2007.
Languages:
Historical Editions: BS EN 62047-6:2010
-
BS 07/30172155 DC
BS EN 62047-5. Semiconductor devices. Micro-electromechanical devices. Part 5. RF MEMS switches
standard by BSI Group, 10/01/2007.
Languages:
-
BS 07/30172404 DC
BS EN 62047-9. Semiconductor devices. Micro-electromechanical devices. Part 9. Wafer to wafer bonding strength measurement for MEMS
standard by BSI Group, 12/05/2007.
Languages:
-
BS 08/30172398 DC
BS EN 62047-8. Semiconductor devices. Micro- electromechanical devices. Part 8. Strip bending test method for tensile property measurement of thin films
standard by BSI Group, 02/18/2008.
Languages:
-
BS 08/30180398 DC
BS EN 60747-16-5. Semiconductor devices. Part 16-5. Microwave integrated circuits . Oscillators
standard by BSI Group, 12/18/2008.
Languages:
- MULTI-USER
-
BS 08/30181404 DC
BS IEC 60747-14-3. Semiconductor devices. Part 14-3. Semiconductor sensors. Pressure sensors
standard by BSI Group, 04/22/2008.
Languages:
-
BS 10/30205425 DC
BS IEC 62047-12. Semiconductor devices. Micro-electromechanical devices. Part 12. A method for fatigue testing thin film materials using the resonant vibration of a MEMS structure
standard by BSI Group, 01/26/2010.
Languages:
