1117232

BS EN 61190-1-3:2002

Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

standard by British-Adopted European Standard , 08/12/2002

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Cross References: IEC 61189-5*IEC 61189-6*IEC 60194:1999*IEC 61190-1-1*EN 61190-1-1:2002*IEC 61190-1-2*EN 61190-1-2:2002*ISO 9002*EN ISO 9002:1994*ISO 9453:1990*EN 29453:1993*ISO 9454-1*EN 29454-1:1993*ISO 9454-2*EN ISO 9454-2:2000*
 

Product Details

Published:
08/12/2002
ISBN(s):
0580402347
Number of Pages:
38
File Size:
1 file , 490 KB
Product Code(s):
30027465, 30027465, 30027465
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN IEC 61190-1-3:2018


    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

    • Most Recent

  2. BS EN 61190-1-3:2007+A1:2010


    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    • Historical Version

  3. BS EN 61190-1-3:2007


    Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    • Historical Version

  4. BS 05/30133287 DC


    IEC 61190-1-3 ED 2. Attachment materials for electronic assembly. Part 1-3. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

    • Historical Version

  5. BS EN 61190-1-3:2002

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    viewing


    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    • Historical Version