This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.

This document provides the measurement procedures for solder alloys both with and without lead (Pb).

Cross References:
IEC 60068-1:2013
IEC 61190-1-3:2007
ISO 683-17:1999
IEC 60068-2-66:1994
ISO 683-1:2016
IEC 61190-1-3:2007/AMD1:2010
ISO 683-4:2014
IEC 60068-2-20:2008
ISO 683-3:2016
ISO 683-2:2016
IEC 60068-2-2:2007
ISO 683-4:2016
IPC J-STD-003C
ISO 6362-4:2012
ISO 6362-6:2012
ISO 9453:2014
IEC 60068-3-13:2016
ISO 9454-1:1990
ISO 6362-2:2014
ISO 6362-1:2012
IEC 61190-1-1:2002
ISO 6362-3:2012
ISO 6362-7:2012
ISO 6362-5:2012


Incorporates the following:
Amendment, September 2019; Corrigendum, May 2018